Etching a substrate: processes – Forming or treating an article whose final configuration has...
Reexamination Certificate
2007-03-20
2007-03-20
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Forming or treating an article whose final configuration has...
C216S044000
Reexamination Certificate
active
10628275
ABSTRACT:
A stamper includes a substrate and a plurality of protrusions of different heights formed on one of the surfaces of the substrate, the protrusions of larger height having a stack structure formed of at least two layers of at least two types of materials, thereby transferring a plurality of patterns at the same time.
REFERENCES:
patent: 4723903 (1988-02-01), Okazaki et al.
patent: 5494782 (1996-02-01), Maenza et al.
patent: 5772905 (1998-06-01), Chou
patent: 5789117 (1998-08-01), Chen
patent: 5817242 (1998-10-01), Biebuyck et al.
patent: 6127263 (2000-10-01), Parikh
patent: 6190809 (2001-02-01), Tzu et al.
patent: 6306547 (2001-10-01), Kobayashi
patent: 6350360 (2002-02-01), Bonivert et al.
patent: 2002/0050220 (2002-05-01), Schueller et al.
patent: 102 17 089 (2003-10-01), None
patent: 1 003 078 (2000-05-01), None
patent: 1 376 663 (2004-01-01), None
patent: 61-3339 (1986-01-01), None
patent: 2-44539 (1990-02-01), None
patent: 3-100942 (1991-04-01), None
patent: 2000-90487 (2000-03-01), None
patent: WO 03/096123 (2003-11-01), None
Communication and Partial European Search Report issued Oct. 15, 2004, for No. EP 03 01 6539.
Li, et al., “Direct three-dimensional patterning using nanoimprint lithography”, Applied Physics Letters. vol. 78, No. 21, May 21, 2001, pp. 3322-3324.
Mingtao, Li et al., Direct Three-Dimensional Patterning Using Nanoimprint Lithography, Applied Physical Letter, American Institute of Physics, May 21, 2001, vol. 78, No. 21, pp. 3322-3324.
European Search Report dated May 6, 2005 in EP 03 01 6539.
Hasegawa Mitsuru
Miyauchi Akihiro
Antonelli, Terry Stout and Kraus, LLP.
Hitachi , Ltd.
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