Stamped and formed stacking device for circuit boards and a meth

Geometrical instruments

Patent

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Details

29874, 339 17C, 339221R, H01R 1122, H01R 4300

Patent

active

045360553

ABSTRACT:
The invention disclosed relates to a device for stacking, securing and spacing printed circuit boards, one on top of another. More particularly, the device is stamped and formed from coplanar stock and includes a reverse bend upper end which provides a receptacle for receiving the lower end of a device mounted in an overlying board or a lead from an electronic device, a lower end and an intermediate section for retaining the device in the board or in dielectric body.

REFERENCES:
patent: 3142891 (1964-08-01), Travis
patent: 3696323 (1972-10-01), Kinkaid et al.
patent: 3850500 (1974-11-01), Cobaugh et al.
patent: 4362353 (1982-12-01), Cobaugh et al.

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