Stamp pad

Details Stamp pad Stamp pad

1975-11-19

1977-11-15

McIntosh, John P.

Coating apparatus

Solid applicator contacting work

Pads or absorbent or porous applicators

B05C 1100

Patent

active

040580857

ABSTRACT:
A hi-fi stamp pad comprising a pad vessel, a substrate whereupon a kind of fiber is vertically planted and thus a flock surface formed thereon, a bolster which is buried under the substrate and contained in the pad vessel whereby to hold ink for stamp use, and a ringlet compulsively rounded the inner brink of the pad vessel to set steadily the substrate upon the bolster. Being first filtered through the substrate, the ink is absorbed upward from the bolster by the flock and accordingly, appropriately wets the flock surface thereof. Once a stamp or seal touches the flock surface, the latter brushes the ink evenly upon the engraved character surface and breaks the ink surface tension built thereupon whereby to regulate the ink adhesion and to make the stamped characters very clear.

REFERENCES:
patent: 425834 (1890-04-01), Sword
patent: 1690275 (1928-11-01), Coryell
patent: 1709182 (1929-04-01), McKnight
patent: 3669071 (1972-06-01), Gates

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