Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2001-01-12
2008-08-12
Kackar, Ram N (Department: 1792)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S008000, C216S009000, C216S010000, C216S013000, C216S052000, C216S053000, C216S058000, C216S083000
Reexamination Certificate
active
07410592
ABSTRACT:
The stamp (10) for a lithographic process, such as patterning a surface layer, of the invention has a stamp body (5) with at least a first recess (11) formed therein, which recess defines a first aperture (15) in the printing face (3) of the stamp (10). The first recess (11) narrows with increasing distance to the printing face, while any cross-section of the first recess, when perpendicularly projected on the printing face (3), will lie within the aperture (15). The printing face may comprise small (11, 12) and large apertures (13) as well as small surfaces (14) in between apertures, while it is nevertheless able to produce prints which are accurate replicas of the printing face. Even details on a submicron scale can be adequately printed. The stamp (10) can be manufactured by a method which comprises anisotropic etching of a first body to make a mold and replicating the mold in the printing face (3) of the stamp (10).
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“Soft Lithography” by Y. Xia et al., Angew. Chem. Int. Ed. 1998, vol. 37, pp. 551-575.
Belk Michael E.
Kackar Ram N
Koninklijke Philips Electronics , N.V.
McKnight Douglas
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