Printing – Stenciling – Stencils
Patent
1994-11-07
1996-12-10
Yan, Ren
Printing
Stenciling
Stencils
101125, B41C 114
Patent
active
055821057
ABSTRACT:
A stamp device includes a stamp unit that can be designed in a compact size, of a light weight and having a low manufacturing cost while preventing ink leakage, and a thermal perforating device that perforates the print face of the stamp unit. The stamp unit includes a grip portion, a stamp unit that is fixedly linked to the grip portion, a skirt member covering the outer peripheral side of the stamp unit, and a protection cap that is freely detachably mounted on the stamp unit. The thermal perforating device for perforating the print face portion of the stamp unit includes a body frame, a keyboard that is provided at the front portion of the body frame and serves to input a perforation character array, a liquid crystal display for displaying the input character array, a thermal perforating unit provided at the rear portion of the body frame and into which the stamp unit is inserted, and a control unit provided inside of the body frame.
REFERENCES:
patent: 4996921 (1991-03-01), Hong
patent: 5184549 (1993-02-01), Imamaki et al.
patent: 5253581 (1993-10-01), Miki et al.
patent: 5285725 (1994-02-01), Imamaki et al.
patent: 5295753 (1994-03-01), Godo et al.
patent: 5329848 (1994-07-01), Yasui et al.
patent: 5454309 (1995-10-01), Fujikawa et al.
patent: 5463947 (1995-11-01), Taira
patent: 5483880 (1996-01-01), Seo et al.
Imamaki Teruo
Miki Takashi
Brother Kogyo Kabushiki Kaisha
Yan Ren
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