Stainless steel member for semiconductor fabrication equipment a

Details Stainless steel member for semiconductor fabrication equipment a Stainless steel member for semiconductor fabrication equipment a

1993-12-07

1996-10-29

Simmons, David A.

Metal treatment

Process of modifying or maintaining internal physical...

Processes of coating utilizing a reactive composition which...

148240, 148286, 420 40, 420 44, 420 46, 420 50, 420 52, 420 57, 420 96, 420 97, 420 98, 4284721, 4284722, C23C 810

Patent

active

055693342

ABSTRACT:
Stainless steel member for semiconductor fabrication equipment having a passive state coating on the surface of the stainless steel comprising, in weight percent, 0.1% or less of C, 2.0% or less of Si, 3.0% or less of Mn, 10% or more of Ni, 15 to 25% of Cr, 1.5 to 4.5% of Mo, 0.5% or less of one or more rare earth element and Fe for substantially the whole remainder. Said passive state coating has a pitting potential of at least 900 mV (when the current density of the anode polarization curve determined with a potentiostat in 3.5% aqueous sodium chloride solution is 10 .mu.A/cm.sup.2) and has a thickness of 0.5 to 20 nm. The invention also includes a surface treatment method for the stainless steel.

REFERENCES:
patent: 4141762 (1979-02-01), Yamaguchi et al.
patent: 4518440 (1985-05-01), Phillips, Jr.
patent: 4636266 (1987-01-01), Asay
patent: 5224998 (1993-07-01), Ohmi et al.
patent: 5226968 (1993-07-01), Ohmi et al.
ASM Metals Handbook, vol. 5 (Surface Cleaning, Finishing, and Coating), pp. 553 and 560; American Society for Metals: Metals Park, Ohio; 1982.
M. A. Barbosa, "If Stainless Steels Are Self-Passivating, Is It Worth Passivating Them In Nitric Acid?", Corrosion and Protection of Materials Review, vol. 2, No. 5 (Nov.-Dec.), 1983; pp. 2-6. (trans.).

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