Stacking structure of printed circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S800000, C361S818000, C361S753000, C361S799000, C174S350000

Reexamination Certificate

active

07952889

ABSTRACT:
A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.

REFERENCES:
patent: 5895884 (1999-04-01), Davidson
patent: 6269008 (2001-07-01), Hsu
patent: 6377472 (2002-04-01), Fan
patent: 6522261 (2003-02-01), Scheffler et al.
patent: 6590783 (2003-07-01), Spratte et al.
patent: 6949706 (2005-09-01), West
patent: 7177161 (2007-02-01), Shima
patent: 7285732 (2007-10-01), Vinokor et al.
patent: 7345248 (2008-03-01), Vinokor et al.
patent: 7623360 (2009-11-01), English et al.
patent: 7633768 (2009-12-01), Horng
patent: 7679935 (2010-03-01), Horng
patent: 7843705 (2010-11-01), Horng
patent: 1327712 (2001-12-01), None
patent: 1592570 (2005-03-01), None
patent: 2887006 (2007-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Stacking structure of printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacking structure of printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacking structure of printed circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2644839

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.