Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2006-12-26
2006-12-26
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S784000, C257SE23078, C257SE23055, C257SE23065, C257SE25006, C257SE25030
Reexamination Certificate
active
07154171
ABSTRACT:
A semiconductor stacking structure has a semiconductor device. A flexible substrate is coupled to a bottom surface of the semiconductor device. The flexible substrate is folded over on at least two sides to form flap portions. The flap portions are coupled to an upper surface of the first semiconductor device and covers only a portion of the upper surface of the semiconductor device.
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Amkor Technology Inc.
Weiss & Moy P.C.
Zarneke David A.
LandOfFree
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