Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-04-12
2005-04-12
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S778000, C257S773000, C257S685000, C257S737000, C257S723000
Reexamination Certificate
active
06879047
ABSTRACT:
A semiconductor stacking structure and method of producing the same has a flexible substrate. A plurality of apertures is formed on the flexible substrate. The plurality of apertures may be formed in groups for coupling semiconductor devices to the flexible substrate. A plurality of traces is formed on the flexible substrate for coupling the plurality of apertures together. A first semiconductor device is coupled to a first side of the flexible substrate. A first adhesive layer is placed on a first side of the flexible substrate for coupling the first semiconductor device to the first side of the flexible substrate. A plurality of contacts is coupled to a second side of the flexible substrate. The contacts and the first adhesive layer liquefy and flow into designated apertures when heated to couple the contacts to the first semiconductor device.
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Amkor Technology Inc.
Flynn Nathan J.
Forde Remmon R.
Weiss, Moy & Harris P.C.
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