Stacking quad pre-molded component packages, systems using...

Details Stacking quad pre-molded component packages, systems using... Stacking quad pre-molded component packages, systems using...

2008-09-22

2010-11-09

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S676000, C257SE23043, C438S123000

Reexamination Certificate

active

07829988

ABSTRACT:
Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.

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