Stacking packages with alignment elements

Details Stacking packages with alignment elements Stacking packages with alignment elements

2011-06-21

2011-06-21

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S774000, C257S797000, C361S735000, C361S790000, C361S792000, C438S109000

Reexamination Certificate

active

07964947

ABSTRACT:
A stacked microelectronic assembly is disclosed, as are different embodiments related to the same. The stacked microelectronic assembly includes a plurality of stackable microelectronic units each having a semiconductor element mounted on a substrate, and also includes alignment elements which align and stack the units one atop another. The aligned assembly may be heated to melt or to reflow the conductive bonding material between the units, thereby electrically coupling and bonding corresponding conductive terminals on each unit.

REFERENCES:
patent: 6476476 (2002-11-01), Glenn
patent: 6760224 (2004-07-01), Moden et al.
patent: 7132311 (2006-11-01), Akiba et al.
patent: 7348726 (2008-03-01), Terao et al.
patent: 7476963 (2009-01-01), Garth
patent: 52075981 (1977-06-01), None

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