Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2001-09-07
2004-04-06
Pert, Evan (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S250000, C361S790000
Reexamination Certificate
active
06717061
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to the field of electronics packaging, and in particular, to high-density electronic modules for housing and interconnecting electronic components located on stacked substrate layers.
2. Description of the Related Art
Increasing the volume density of electronic packaging is crucial for reducing device sizes for a given functionality. Efforts to provide high-density electronic packaging have included three-dimensional stacking technology in an attempt to avoid the inherent geometric constraints of standard two-dimensional semiconductor integrated circuits (“ICs”). By stacking electronic modules on top of one another and providing interconnections between the modules, the multiple layers can provide additional circuit elements without extending the two-dimensional footprint beyond that of a single module. Certain embodiments have also included beat-conducting, electrically insulating layers to improve heat dissipation during operation of these stacked electronic modules.
Numerous packaging schemes have been developed for stacking silicon-based ICs to increase the volume densities of electronic devices. However, while the silicon wafers of the silicon-based ICs provide rigidity and stability for the electronic elements, the ultimate volume densities of the multilayer stacks are inherently limited due to the thicknesses of the silicon wafers. Lapping off excess silicon from the back side of silicon wafers before stacking has been used to decrease the thickness of the silicon layers, and hence increase the number of layers per unit height. However, this procedure is time-consuming and requires precise machining to avoid damaging the circuit elements.
SUMMARY OF THE INVENTION
In accordance with one aspect of an embodiment of the invention, each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein. The plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side. The first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side. The second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further comprises a heat-separating layer disposed between the top side of the first layer and the bottom side of the second layer. The first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.
In accordance with another aspect of an embodiment of the invention, a method provides a plurality of releasably adhered multilayer modules. The method comprises providing a first multilayer module comprising a first layer having a top side and bottom side. The first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The method further comprises providing a second multilayer module comprising a second layer having a top side and bottom side. The second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The method further comprises releasably adhering the first multilayer module to the second multilayer module by disposing a heat-separating layer between the top side of the first layer and the bottom side of the second layer.
In accordance with another aspect of an embodiment of the invention, each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a flexible substrate therein. The plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side. The first layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side. The second layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further comprises a heat-separating layer disposed between the top side of the first layer and the bottom side of the second layer. The first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.
In accordance with another aspect of an embodiment of the invention, a method provides a plurality of releasably adhered multilayer modules. The method comprises providing a first multilayer module comprising a first layer having a top side and bottom side. The first layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces. The method further comprises providing a second multilayer module comprising a second layer having a top side and bottom side. The second layer comprises a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces. The method further comprises releasably adhering the first multilayer module to the second multilayer module by disposing a heat-separating layer between the top side of the first layer and the bottom side of the second layer.
In accordance with another aspect of an embodiment of the invention, a method separates a plurality of releasably adhered multilayer modules. The method comprises providing a first multilayer module releasably adhered to a second multilayer module by disposing a heat-separating layer between the first and second multilayer modules. The first multilayer module comprises a first layer with a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module comprises a second layer with a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The method further comprises applying heat to the heat-separating layer, thereby releasing the first multilayer module from the second multilayer module. The method further comprises separating the first multilayer module from the second multilayer module.
In accordance with another aspect of an embodiment of the invention, each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein. The plurality of multilayer modules comprises a first multilayer module comprising a first layer having a top side and bottom side. The first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further comprises a second multilayer module comprising a second layer having a top side and bottom side. The second layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further comprises a metal layer disposed between and adhered to the top side of the first layer and the bottom side of the second layer, whereby the first multilayer module is adhered to the second multilayer module.
In accordance with another aspect of an embodiment of the invention, a method provides a plurality of multilayer modules. Each multilayer module has a plurality of layers wherein each layer has a substrate therein. The method comprises providing a first multilayer module comprising a first layer having a top side and bottom side. The first layer comprises a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The method further comprises providing a second multil
Camien Andrew Nelson
Ozguz Volkan H.
Pepe Angel Antonio
Yamaguchi James Satsuo
Andras Joseph C.
Dinh Tuan
Irvine Sensors Corporation
Myers Dawes Andras & Sherman LLP
Pert Evan
LandOfFree
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