Stacked wafer electronic package

Details Stacked wafer electronic package Stacked wafer electronic package

1989-03-29

1990-09-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

16510433, 357 82, 361382, 361396, H05K 720

Patent

active

049567462

ABSTRACT:
The electronic package (10) is comprised of a plurality of support plates (12-24), each of which has a plenum therein and preferably webs extending into the plenum for fluid flow control and heat transfer. A wafer (104) is mounted in a recess (100) in the support plate (12) so that fluid in the plenum (52) directly cools the wafer. Electrical connection is by flexible cable (108) to an exterior printed wiring board (40). The package may have any selected number of support plates, and each support plate may carry one full-sized wafer for compact packaging.

REFERENCES:
patent: 3290559 (1966-12-01), Kirby
patent: 3515949 (1970-06-01), Michaels
patent: 4158875 (1979-06-01), Tajima
patent: 4493010 (1985-01-01), Morrison
patent: 4603344 (1986-07-01), Trommer
patent: 4712158 (1987-12-01), Kikuchi
patent: 4841355 (1989-06-01), Parks
Universal Electronic Package, Goldmann, IBM Tech. Discl. Bull., vol. 27, No. 6, Nov. 1984, p. 3335.

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