Stacked-type semiconductor device

Details Stacked-type semiconductor device Stacked-type semiconductor device

2007-05-15

2007-05-15

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25027, C257S685000, C257S723000, C257S777000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

10867722

ABSTRACT:
A stacked-type semiconductor device includes a first wiring substrate on which a semiconductor device element is mounted, a second wiring substrate stacked on the first wiring substrate through a plurality of electrode terminals which are electrically connected with the first wiring substrate, and a conductor supporting member disposed around the semiconductor device element, and connected with grounding wiring layers provided in the first and second wiring substrate.

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patent: 2003-3539 (2003-01-01), None
Korean Office Action dated Jan. 27, 2006 for a corresponding Korean application No. 10-2004-0046997.

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