Stacked tab leadframe assembly

Details Stacked tab leadframe assembly Stacked tab leadframe assembly

1991-03-26

1992-03-24

Hille, Rolf

357 80, H01L 2314, H01L 2348, H01L 2354

Patent

active

050993062

ABSTRACT:
Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes.

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