Stacked structure having matrix-fibered composite layers and a m

Details Stacked structure having matrix-fibered composite layers and a m Stacked structure having matrix-fibered composite layers and a m

1982-02-02

1984-11-13

James, Andrew J.

357 71, 357 68, 357 81, H01L 2314, H01L 2318, H01L 2354

Patent

active

044829124

ABSTRACT:
Herein disclosed is a stacked or laminated structure which is rigidly integrated by sandwiching a metal layer between a first matrix-fiber composite layer prepared to have as a whole a thermal expansion coefficient and a second matrix-fiber layer prepared to have as a whole another thermal expansion coefficient different from that of the first matrix-fiber composite layer. The intervening metal layer acts as a buffer for the first and second matrix-fiber composite layers. The stacked structure according to the present invention can by used as the chip carrier of a semiconductor device, for example.

REFERENCES:
patent: 3097329 (1963-07-01), Siemens
patent: 3858096 (1974-12-01), Kuhrt et al.
patent: 4320412 (1982-03-01), Hynes et al.

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