Stacked semiconductor packages and method therefor

Details Stacked semiconductor packages and method therefor Stacked semiconductor packages and method therefor

2007-07-10

2007-07-10

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000, C438S107000

Reexamination Certificate

active

10906697

ABSTRACT:
A stackable semiconductor package and method includes providing a first semiconductor package having a first plurality of lower leads and a first plurality of upper leads. A second semiconductor package having a second plurality of lower leads is provided. The second plurality of lower leads is attached to the first plurality of upper leads to form a stack of semiconductor packages.

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