Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-04-26
2011-04-26
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S691000, C257S723000, C257SE23169, C257SE21506, C408S109000
Reexamination Certificate
active
07932591
ABSTRACT:
The present invention relates to a stacked semiconductor package having flexible circuit board therein. The semiconductor package comprises a substrate and a chip assembly. The chip assembly comprises at least a first chip, a second chip and a flexible circuit board. The second chip is disposed above the first chip, and is electrically connected to the first chip by the flexible circuit board. The chip assembly is electrically connected to the substrate. As a result, the interposer of prior art is omitted, the overall thickness of the stacked semiconductor package of the present invention is reduced, and the manufacturing procedure is simplified.
REFERENCES:
patent: 6225688 (2001-05-01), Kim et al.
patent: 6803649 (2004-10-01), He
patent: 2005/0233496 (2005-10-01), Haba et al.
patent: 2006/0252181 (2006-11-01), King et al.
patent: 2009/0108432 (2009-04-01), Lee
Advanced Semiconductor Engineering Inc.
Hsu Winston
Lam Cathy N
Margo Scott
Nguyen Cuong Q
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