Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-06-21
2011-06-21
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23085, C257SE23004, C257SE23069, C257SE23023, C257SE25006, C257S698000, C257S737000, C257S685000, C257S680000, C257S773000, C257S774000, C257S778000, C257S777000, C257SE23060
Reexamination Certificate
active
07964952
ABSTRACT:
A stackable package substrate has an opening shaped and dimensioned to accommodate but not contact a mold cap of a package upon which the stackable package is to be mounted. On the die attach surface, the frame substrate accommodates a die attach margin adjacent at the edge of the opening; and a row of wire bond sites arranged along at an outer frame edge, for electrical interconnection. The frame substrate accommodates z-interconnect ball pads arranged to align with corresponding z-interconnect pads on the substrate of a package. A stackable package has a frame substrate. A stacked package assembly includes a second package mounted on a first package using peripheral solder ball z-interconnect, in which the first package includes a die enclosed by a mold cap and in which the second package includes one die mounted on the frame substrate.
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Williams Alexander O
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