Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-03-15
2011-03-15
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C257S790000, C257SE23085, C257SE23126, C438S026000, C438S107000, C438S109000
Reexamination Certificate
active
07906855
ABSTRACT:
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
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pate
Chung Ji Young
Ha Sung Chul
Kim Bong Chan
Kim Do Hyung
Kim In Tae
Amkor Technology Inc.
Clark Jasmine J
Stetina Brunda Garred & Brucker
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