Stacked semiconductor package

Details Stacked semiconductor package Stacked semiconductor package

2006-03-17

2010-12-14

Gurley, Lynne A (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S691000, C257S698000, C257S700000, C257S778000, C257SE23021, C257SE23062, C257SE23079, C257SE23178, C257SE25013, C257SE25021, C257SE25023, C257SE25018, C257SE25006

Reexamination Certificate

active

07851900

ABSTRACT:
In a stacked semiconductor package, since electric power is supplied to a second semiconductor package through a first semiconductor package, a power supply path becomes complicated and fluctuation of its inductance becomes large, whereby power bounce occurs to reduce signal quality and also prevent high speed signal communication. Therefore, according to the present invention, a first solder ball group for joint to a printed wiring board is attached to a second layer of the first semiconductor package, and a second solder ball group for joint to the first semiconductor package and a solder group for power supply for direct joint to the printed wiring board are provided on the second layer of the second semiconductor package, whereby electric power can be directly supplied from the printed wiring board.

REFERENCES:
patent: 6448506 (2002-09-01), Glenn et al.
patent: 2004/0135243 (2004-07-01), Aoyagi
patent: 2004-253667 (2004-09-01), None

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