Stacked semiconductor module

Details Stacked semiconductor module Stacked semiconductor module

2006-05-02

2006-05-02

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000

Reexamination Certificate

active

07037757

ABSTRACT:
The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrated circuit dice. The programmable memory device is programmable to identify the integrated circuit dice that meet a predetermined standard, such as an operating frequency requirement, or a core timing grade. Further, a method is provided for accessing a semiconductor module. The above mentioned housing is provided to enclose the plurality of integrated circuit dice and the programmable memory device. The integrated circuit dice of the plurality of integrated circuit dice that meet a predetermined standard are then identified. The programmable memory device is subsequently programmed to identify the selected integrated circuit dice.

REFERENCES:
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 6057598 (2000-05-01), Payne et al.
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6340845 (2002-01-01), Oda
patent: 6376904 (2002-04-01), Haba et al.
patent: 6452259 (2002-09-01), Akiyama
patent: 2001/0000489 (2001-04-01), Farnworth

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