Stacked semiconductor memory device and semiconductor memory mod

Details Stacked semiconductor memory device and semiconductor memory mod Stacked semiconductor memory device and semiconductor memory mod

1993-03-02

1994-08-02

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257698, 257700, 361729, 361744, 361784, H01L 2316

Patent

active

053348753

ABSTRACT:
There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.

REFERENCES:
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4949158 (1990-08-01), Ueda
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4996583 (1991-02-01), Hatada
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5198888 (1993-03-01), Sugano et al.

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