Stacked semiconductor device and semiconductor memory device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257S777000

Reexamination Certificate

active

07968993

ABSTRACT:
A stacked semiconductor device includes a first semiconductor element mounted on a wiring board and a second semiconductor element stacked on the first semiconductor element. Electrode pads of the first and second semiconductor elements are electrically connected to connection pads of the wiring board via first and second metal wires. The second metal wire is wired so that a part thereof is in contact with an insulating protective film covering a surface of the first semiconductor element.

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patent: 6683385 (2004-01-01), Tsai et al.
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patent: 7795741 (2010-09-01), Kikuchi et al.
patent: 7868462 (2011-01-01), Choi et al.
patent: 2004/0201088 (2004-10-01), Kim et al.
patent: 2006/0175697 (2006-08-01), Kurosawa et al.
patent: 2005-116915 (2005-04-01), None

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