Stacked semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257S724000

Reexamination Certificate

active

07489030

ABSTRACT:
As a defective contact recovery elements, a stacked semiconductor device include a parallel arrangement system in which signal paths are multiplexed, and a defective contact recovery circuit operable to switch a signal path into an auxiliary signal path. The parallel arrangement system is used in a case where the number of signals is small and a very high speed operation is required because of a serial data transfer. The defective contact recovery circuit is used in a case where the number of signals is large because of a parallel data transfer.

REFERENCES:
patent: 5786628 (1998-07-01), Beilstein et al.
patent: 6711810 (2004-03-01), Buley et al.
patent: 6838775 (2005-01-01), Takahashi
patent: 7067914 (2006-06-01), Malinowski et al.
patent: 2003/0113990 (2003-06-01), Grube et al.
patent: 2005/0161794 (2005-07-01), Kato et al.
patent: 2005/0239347 (2005-10-01), Chamberlin et al.
patent: 2004-095799 (2004-03-01), None
patent: 2004-152810 (2004-05-01), None
patent: 2004-152811 (2004-05-01), None
patent: 2004-152812 (2004-05-01), None
patent: 2004-327474 (2004-11-01), None
patent: WO 97/11492 (1997-03-01), None

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