Stacked semiconductor device

Details Stacked semiconductor device Stacked semiconductor device

2011-08-09

2011-08-09

Sandvik, Benjamin P (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S678000, C257S777000, C257SE21614, C257SE23085, C257SE25013, C257SE25018, C257SE25027, C438S109000

Reexamination Certificate

active

07994620

ABSTRACT:
A stacked semiconductor device includes a first semiconductor element bonded on a circuit base. The first semiconductor element is electrically connected to a connection part of the circuit base via a first bonding wire. A second semiconductor element is bonded on the first semiconductor element via a second adhesive layer with a thickness of 50 μm or more. The second adhesive layer is formed of an insulating resin layer whose glass transition temperature is 135° C. or higher and whose coefficient of linear expansion at a temperature equal to or lower than the glass transition temperature is 100 ppm or less.

REFERENCES:
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6657290 (2003-12-01), Fukui et al.
patent: 6833287 (2004-12-01), Hur et al.
patent: 2005/0107497 (2005-05-01), Akaho et al.
patent: 2005/0205981 (2005-09-01), Yoshimura et al.
patent: 2006/0044735 (2006-03-01), Hayashi et al.
patent: 2006/0139893 (2006-06-01), Yoshimura et al.
patent: 2006/0226520 (2006-10-01), Yoshimura et al.
patent: 2001-308262 (2001-11-01), None
patent: 2002-222913 (2002-08-01), None
patent: 2003-218316 (2003-07-01), None
patent: 2003-258034 (2003-09-01), None
patent: 2004-072009 (2004-03-01), None
patent: 2006-5333 (2006-01-01), None
patent: 2006-005333 (2006-01-01), None
patent: 10-2004-0091013 (2004-10-01), None
patent: 10-0461220 (2004-12-01), None
patent: WO 02/075809 (2002-09-01), None
patent: WO 2006/109506 (2006-10-01), None
Fukui, Y. et al., “Semiconductor Device and Manufacture the Same,” Patent Abstract of Taiwanese Patent No. TW544902B, Aug. 1, 2003, 1 page.
Office Action issued by the Korean Patent Office on Feb. 26, 2008, for Korean Patent Application No. 10-2007-25370, and English-language Summary thereof.
Notice of Reasons for Rejection issued by the Japanese Patent Office on Jul. 27, 2010, for Japanese Patent Application No. 2006-073142, and English-language translation thereof.

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