Stacked semiconductor device

Details Stacked semiconductor device Stacked semiconductor device

1998-07-22

2000-07-04

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257685, 257723, 257778, 257737, 257738, 257696, 257693, H01L 2340, H01L 2334, H01L 2348, H01L 2350, H05K 720

Patent

active

060842938

ABSTRACT:
In a stack type semiconductor device 1, front ends of leads 11 provided at two sides of a first semiconductor device 10 are bent inward to hold a second semiconductor device 20 stacked at the rear surface of the first semiconductor device 10. Since the second semiconductor device 20 is held toward the inside relative to the leads 11 of the first semiconductor device 10, the distance between the outer surfaces of the leads 11 does not increase. Thus, the mounting area does not increase compared to the mounting area required when mounting a single first semiconductor device 10, and furthermore, high density mounting becomes possible by stacking the second semiconductor device 20.

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