Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-06-28
2011-06-28
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE21505, C257SE23001, C257S686000, C257S723000, C257S784000, C257S786000, C257S796000, C257S728000, C361S783000
Reexamination Certificate
active
07969018
ABSTRACT:
Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane.
REFERENCES:
patent: 6359790 (2002-03-01), Meyer-Berg
patent: 7489044 (2009-02-01), Pu et al.
patent: 7564137 (2009-07-01), Lam
patent: 2004/0012992 (2004-01-01), Koh et al.
patent: 2004/0262735 (2004-12-01), Higashi et al.
patent: 2005/0110162 (2005-05-01), Meyer-Berg et al.
patent: 2005/0133916 (2005-06-01), Karnezos
patent: 2006/0091518 (2006-05-01), Grafe et al.
patent: 2007/0040260 (2007-02-01), Otremba
patent: 2007/0108560 (2007-05-01), Tang et al.
patent: 2007/0187826 (2007-08-01), Shim et al.
patent: 2007/0215996 (2007-09-01), Otremba
patent: 2007/0228556 (2007-10-01), Hosseini et al.
patent: 2007/0257348 (2007-11-01), Yang
patent: 2008/0006923 (2008-01-01), Otremba
patent: 2008/0012110 (2008-01-01), Chong et al.
patent: 2008/0017907 (2008-01-01), Otremba
patent: 2009/0072413 (2009-03-01), Mahler et al.
patent: 2009/0085185 (2009-04-01), Byun et al.
patent: 2010/0019391 (2010-01-01), Strzalkowski
patent: 2010/0078784 (2010-04-01), Otremba
Hoeglauer Josef
Otremba Ralf
Schloegel Xaver
Tong Soon Hock
Wong Kwai Hong
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Williams Alexander O
LandOfFree
Stacked semiconductor chips with separate encapsulations does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked semiconductor chips with separate encapsulations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked semiconductor chips with separate encapsulations will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2630471