Stacked semiconductor chips with separate encapsulations

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257SE21505, C257SE23001, C257S686000, C257S723000, C257S784000, C257S786000, C257S796000, C257S728000, C361S783000

Reexamination Certificate

active

07969018

ABSTRACT:
Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane.

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