Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-04-12
2011-04-12
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S109000, C257S676000, C257SE23052
Reexamination Certificate
active
07923300
ABSTRACT:
A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.
REFERENCES:
patent: 4924112 (1990-05-01), Anderson et al.
patent: 5119159 (1992-06-01), Hoshi
patent: 5242841 (1993-09-01), Smayling et al.
patent: 6700793 (2004-03-01), Takagawa et al.
patent: 6710439 (2004-03-01), Lee et al.
patent: 2003/0098468 (2003-05-01), Wheeler et al.
patent: 2005/0179472 (2005-08-01), Nakamura et al.
patent: 2005/0245020 (2005-11-01), Zhu et al.
patent: 2005/0280163 (2005-12-01), Schaffer et al.
patent: 2006/0231904 (2006-10-01), Kocon
patent: 2007/0158778 (2007-07-01), Kitabatake et al.
patent: 2007/0249092 (2007-10-01), Joshi et al.
patent: 2009/0057869 (2009-03-01), Hebert et al.
patent: 2009/0072368 (2009-03-01), Hu et al.
patent: 2009/0263947 (2009-10-01), Hebert
patent: 2010/0133644 (2010-06-01), Hebert
patent: 2010/0140693 (2010-06-01), Hebert
patent: 2010/0155837 (2010-06-01), Hebert
patent: 2010/0155915 (2010-06-01), Bell et al.
patent: 20050085461 (2005-08-01), None
International Searching Authority, “International Search Report”, Jun. 14, 2010, Published in: WO.
Bell David B.
Hebert Francois
Kelkar Nikhil
Fogg & Powers LLC
Intersil America's Inc.
Novacek Christy L
Smith Zandra
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