Stacked package module

Details Stacked package module Stacked package module

2007-03-06

2007-03-06

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

10934409

ABSTRACT:
A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.

REFERENCES:
patent: 6291897 (2001-09-01), Wark et al.
patent: 6700783 (2004-03-01), Liu et al.
patent: 6870248 (2005-03-01), Shibata
patent: 6876074 (2005-04-01), Kim
patent: 2002/0140107 (2002-10-01), Kato et al.
patent: 2003/0042589 (2003-03-01), Hong
patent: 2003/0057552 (2003-03-01), Kainuma et al.
patent: 2004/0124520 (2004-07-01), Rinne
patent: 2004/0155326 (2004-08-01), Kanbayashi
patent: 2004/0212098 (2004-10-01), Pendse
patent: 527018 (2003-04-01), None

Affiliated with

Also associated with

Rating

Stacked package module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked package module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked package module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3768699