Stacked package electronic device

Details Stacked package electronic device Stacked package electronic device

2007-07-17

2007-07-17

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

C257SE23114

Reexamination Certificate

active

10880998

ABSTRACT:
An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.

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