Stacked multiple electronic component interconnect structure

Details Stacked multiple electronic component interconnect structure Stacked multiple electronic component interconnect structure

2007-11-13

2008-10-21

Ta, Tho D. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S066000

Reexamination Certificate

active

07438557

ABSTRACT:
A stacked multiple electronic component interconnect structure includes a connector portion having a first and second connector surfaces. A first double sided land grid array having a first surface provided with a first plurality of connector units and a second surface provided with a second plurality of connector units, is positioned on the first connector surface. A second double sided land grid array having a first surface provided with a first plurality of connector units and a second surface provided with a second plurality of connector units is positioned on the second connector surface. A first electronic component is mounted to the second surface of the first land grid array and a second electronic component is mounted to the second surface of the second land grid array to form a stacked multiple electronic component interconnect structure that conserves space on an electronic board.

REFERENCES:
patent: 5935687 (1999-08-01), Davidson et al.
patent: 6435883 (2002-08-01), Warren
patent: 6590159 (2003-07-01), Fan et al.
patent: 6903941 (2005-06-01), Paola
patent: 7160119 (2007-01-01), Rathburn

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