Stacked module systems and methods

Details Stacked module systems and methods Stacked module systems and methods

2007-10-04

2009-08-11

Le, Thao X (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S109000, C438S508000, C257S777000, C257S723000, C257S686000, C257SE23001

Reexamination Certificate

active

07572671

ABSTRACT:
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the contacts of the lower CSP will be compressed before flex circuitry is attached to a combination of the CSP and a form standard to create lower profile contacts between CSP and the flex circuitry.

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