Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-10-31
2010-02-02
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S772000, C361S774000, C361S790000
Reexamination Certificate
active
07656678
ABSTRACT:
The present invention stacks integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive respectively are applied to selected locations on the flex circuitry. Supplemental adhesive is applied to additional locations on the flex circuitry, CSP, or other component. The flex circuitry and the CSP are brought into proximity with each other. During solder reflow operation, a force is applied and the CSP collapses toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond providing additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components with a combination of adhesives. A rapid bond adhesive maintains alignment of the bonded packages and/or components during assembly, and a structural bond adhesive provides additional strength and/or structural integrity to the bond.
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Partridge Julian
Roper David L.
Villani Joseph
Wehrly, Jr. James Douglas
Civins Denko Coburn & Lauff LLP
Dinh Tuan T
Entorian Technologies LP
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