Stacked module and substrate therefore

Details Stacked module and substrate therefore Stacked module and substrate therefore

1998-10-23

1999-11-30

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 365 51, H05K 111, G11C 506

Patent

active

059953799

ABSTRACT:
Substrates 1, 2 include chip select electrode pads B1, B2, C1, C2, and first chip select electrode pads B1, C1 are connected to chip select terminals of semiconductor chips 3, 4. The other chip select electrodes B2, C2 are connected to opposite surface side electrodes B1', C1' positioned on the opposite surface side of the chip select electrodes B1, C1 adjacent in the direction of the first chip select electrodes. The opposite surface side electrode B1 and the chip select electrode C1 of the substrate confronted therewith are connected to each other by a conductive bump 6. Thus, the substrates 1, 2 have the same structure.

REFERENCES:
patent: 5130894 (1992-07-01), Miller
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5343075 (1994-08-01), Nishino
patent: 5397916 (1995-03-01), Normington
patent: 5434452 (1995-07-01), Higgins, III
patent: 5434745 (1995-07-01), Shokrgozar et al.
patent: 5585675 (1996-12-01), Knopf
patent: 5854507 (1998-12-01), Miremadi et al.

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