Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-03-20
2010-10-05
Dang, Trung (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000, C257SE21599
Reexamination Certificate
active
07807499
ABSTRACT:
A manufacturing method of a stacked module includes a step of fabricating the first wiring board which includes a wiring pattern provided on at least one of a surface and an inner portion and a bump electrode which is integrated from the simultaneous sintering with the wiring pattern, and which extends in the vertical direction, a step of layering the first wiring board with the second wiring board having the wiring pattern provided on at least one of the surface and the inner portion thereof to be connected to the second wiring board via the bump electrode.
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Dang Trung
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
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