Stacked memory module in mirror image arrangement and method...

Details Stacked memory module in mirror image arrangement and method... Stacked memory module in mirror image arrangement and method...

2006-10-24

2008-03-04

Gibson, Randy W. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S686000, C257S738000

Reexamination Certificate

active

07339794

ABSTRACT:
A stacked memory module is manufactured in mirror image arrangement and a method for the same. The pins of a first memory unit and pins of a second memory unit are electrically connected to an upper face and a lower face of a first printed circuit board made of rigid material. The pins of the second memory unit are in mirror image arrangement with respect to the pins of the first memory unit. Two second PCBs are made of flexible material and electrically connected to both sides of the first PCB. Conductive contacts such as gold fingers are electrically connected to circuit on the second PCB. The manufacture cost is reduced and manufacture process is simplified. The signal quality is enhanced because the signal paths are uniform and the load impedance is reduced.

REFERENCES:
patent: 6347735 (2002-02-01), Frantz et al.
patent: 2004/0262734 (2004-12-01), Yoo
patent: 2006/0049504 (2006-03-01), Corisis et al.

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