Stacked memory and manufacturing method thereof

Details Stacked memory and manufacturing method thereof Stacked memory and manufacturing method thereof

2006-09-08

2008-10-07

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C438S123000

Reexamination Certificate

active

07432131

ABSTRACT:
To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.

REFERENCES:
patent: 5371560 (1994-12-01), Kiehne et al.
patent: 5377077 (1994-12-01), Burns
patent: 5397916 (1995-03-01), Normington
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5840417 (1998-11-01), Bolger
patent: 6238599 (2001-05-01), Gelorme et al.
patent: 6424031 (2002-07-01), Glenn
patent: 7145227 (2006-12-01), Ebihara et al.
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 05-191028 (1993-07-01), None
patent: 11-111914 (1999-04-01), None
patent: 11-137516 (1999-05-01), None
patent: 2000-031617 (2000-01-01), None
patent: 2000-286380 (2000-10-01), None
patent: 2002-009227 (2002-01-01), None
patent: WO 99/65062 (1999-12-01), None
patent: WO 01/06562 (2001-01-01), None

Affiliated with

Also associated with

Rating

Stacked memory and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked memory and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked memory and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4002939