Stacked interdigitated lead frame assembly

Details Stacked interdigitated lead frame assembly Stacked interdigitated lead frame assembly

1984-01-09

1985-01-29

James, Andrew J.

357 81, 357 80, H01L 2348, H01L 2302, H01L 3902

Patent

active

044969651

ABSTRACT:
An integrated circuit package having a large number of external connections is assembled using two lead frames stacked one atop the other. The lead frames have complementary lead patterns which interdigitate to provide a very close lead spacing at the periphery of a semiconductor chip on which a complex integrated circuit is fabricated.

REFERENCES:
patent: 1649741 (1927-11-01), Ruben
patent: 3469017 (1967-12-01), Starger
patent: 3646409 (1972-02-01), van de Water et al.
patent: 3676748 (1972-07-01), Kobayashi et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4195193 (1980-03-01), Grabbe et al.

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