Stacked integrated circuits package system with dense...

Details Stacked integrated circuits package system with dense... Stacked integrated circuits package system with dense...

2005-12-16

2008-11-04

Ha, Nathan W (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

07445962

ABSTRACT:
A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.

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