Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2010-05-19
2011-11-29
Mandala, Victor A (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C257S686000, C257SE21602
Reexamination Certificate
active
08067268
ABSTRACT:
A method for manufacturing of a stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer; and mounting a top integrated circuit package over the intermediate integrated circuit package.
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Carson Flynn
Ha Jong-Woo
Hong BumJoon
Lee SeongMin
Ishimaru Mikio
Mandala Victor A
Moore Whitney T
Stats Chippac Ltd.
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