Stacked integrated circuit package-in-package system

Details Stacked integrated circuit package-in-package system Stacked integrated circuit package-in-package system

2006-12-09

2009-12-22

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE21518, C257SE23180, C438S106000

Reexamination Certificate

active

07635913

ABSTRACT:
A stacked integrated circuit package-in-package system is provided including forming a substrate with a top contact, mounting a first device having a first terminal over the substrate, stacking a second device having a second terminal over the first device in an offset configuration, connecting the first terminal to the top contact below the first terminal, and connecting the second terminal to the top contact below the second terminal.

REFERENCES:
patent: 5309026 (1994-05-01), Matsumoto
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6353265 (2002-03-01), Michii
patent: 6414396 (2002-07-01), Shim et al.
patent: 6445064 (2002-09-01), Ishii et al.
patent: 6627480 (2003-09-01), Kim
patent: 6686656 (2004-02-01), Koh et al.
patent: 6750080 (2004-06-01), Masuda et al.
patent: 7061087 (2006-06-01), Kim
patent: 7071547 (2006-07-01), Kang et al.
patent: 7078264 (2006-07-01), Yang
patent: 7105919 (2006-09-01), Kim
patent: 7116002 (2006-10-01), Chao et al.
patent: 2002/0079570 (2002-06-01), Ho et al.
patent: 2003/0102567 (2003-06-01), Eskildsen
patent: 2005/0067694 (2005-03-01), Pon et al.
patent: 2006/0189033 (2006-08-01), Kim
patent: 2007/0278643 (2007-12-01), Yee
patent: 2008/0006925 (2008-01-01), Yim et al.
patent: 2008/0029866 (2008-02-01), Kim et al.
patent: 2008/0029867 (2008-02-01), Kim et al.
patent: 2008/0054435 (2008-03-01), Mehta et al.

Affiliated with

Also associated with

Rating

Stacked integrated circuit package-in-package system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked integrated circuit package-in-package system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked integrated circuit package-in-package system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4147741