Stacked integrated circuit package-in-package system

Details Stacked integrated circuit package-in-package system Stacked integrated circuit package-in-package system

2006-04-18

2008-09-02

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S723000, C257S777000

Reexamination Certificate

active

07420269

ABSTRACT:
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in an offset configuration with the first peripheral contact exposed, the offset configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate top contact, and electrically connecting the second peripheral contact and the package substrate top contact.

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