Stacked integrated circuit package-in-package system

Details Stacked integrated circuit package-in-package system Stacked integrated circuit package-in-package system

2007-12-25

2007-12-25

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S782000

Reexamination Certificate

active

11331564

ABSTRACT:
A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

REFERENCES:
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6093969 (2000-07-01), Lin
patent: 6927484 (2005-08-01), Thomas et al.
patent: 6939739 (2005-09-01), Corisis
patent: 2004/0113256 (2004-06-01), Thomas et al.
patent: 2004/0145039 (2004-07-01), Shim et al.
patent: 2004/0159954 (2004-08-01), Hetzel et al.

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