Stacked integrated circuit leadframe package system

Details Stacked integrated circuit leadframe package system Stacked integrated circuit leadframe package system

2006-01-11

2008-11-04

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S686000, C257S787000, C257S784000, C438S123000

Reexamination Certificate

active

07446396

ABSTRACT:
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.

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