Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-01-25
2009-10-20
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S778000, C257S686000, C257SE23021
Reexamination Certificate
active
07605477
ABSTRACT:
A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.
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Chan Polwin C.
Dearden Timothy E.
Hauhe Mark S.
Quan Clifton
Sox Stephen E.
Parekh Nitin
Pillsbury Winthrop Shaw & Pittman LLP
Raytheon Company
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