Inductor devices – Plural part core
Reexamination Certificate
2005-08-12
2009-10-06
Enad, Elvin G (Department: 2832)
Inductor devices
Plural part core
C336S131000
Reexamination Certificate
active
07598839
ABSTRACT:
Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a longitudinal coaxial arrangement) such that the back of one core element associated with a first inductor provides a magnetic flux path for a second inductor. Form-less (bonded) windings are also optionally used to simplify the manufacture of the device, reduce its cost, and allow it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB.
REFERENCES:
patent: 4146859 (1979-03-01), Quirke
patent: 4498067 (1985-02-01), Kumokawa et al.
patent: 5212345 (1993-05-01), Gutierrez
patent: 5309130 (1994-05-01), Lint
patent: 5351167 (1994-09-01), Wai et al.
patent: 5534838 (1996-07-01), Lindberg
patent: 5726615 (1998-03-01), Bloom
patent: 6005467 (1999-12-01), Abramov
patent: 6087920 (2000-07-01), Abramov
patent: 6087921 (2000-07-01), Morrison
patent: 6501362 (2002-12-01), Hoffman et al.
patent: 6525638 (2003-02-01), Oi
patent: 6642827 (2003-11-01), McWilliams et al.
patent: 6734773 (2004-05-01), Ackermann
patent: 7009482 (2006-03-01), Kiko et al.
patent: 7057486 (2006-06-01), Kiko
patent: 7109837 (2006-09-01), Watts et al.
patent: 2005/0046534 (2005-03-01), Gilmartin et al.
Baisa Joselito
Enad Elvin G
Gazdzinski & Associates, PC
Pulse Engineering Inc.
LandOfFree
Stacked inductive device and methods of manufacturing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked inductive device and methods of manufacturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked inductive device and methods of manufacturing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4082560