Stacked IC device having functions for selecting and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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C257S686000, C438S109000

Reexamination Certificate

active

10999610

ABSTRACT:
In the formation of a stacked IC device formed by stacking IC chips by a plurality of levels, the number of selecting bonding wires connected to select an IC chip on a certain level is reduced. The selecting device of the IC chip on each of the levels is connected to the selecting device on a neighboring level in the form of a chain to form a shift register so that only when a trigger signal is applied to the selecting device, the selecting device sequentially transmits a signal held in itself to the selecting device on the neighboring level.

REFERENCES:
patent: 5656548 (1997-08-01), Zavracky et al.
patent: 6621155 (2003-09-01), Perino et al.
patent: 6720643 (2004-04-01), Fox et al.
patent: 7037757 (2006-05-01), Fox et al.
patent: 2002/0040990 (2002-04-01), Tanaka et al.
patent: 6-291250 (1994-10-01), None

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