Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-05-22
2007-05-22
Tan, Vibol (Department: 2819)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C438S109000
Reexamination Certificate
active
10999610
ABSTRACT:
In the formation of a stacked IC device formed by stacking IC chips by a plurality of levels, the number of selecting bonding wires connected to select an IC chip on a certain level is reduced. The selecting device of the IC chip on each of the levels is connected to the selecting device on a neighboring level in the form of a chain to form a shift register so that only when a trigger signal is applied to the selecting device, the selecting device sequentially transmits a signal held in itself to the selecting device on the neighboring level.
REFERENCES:
patent: 5656548 (1997-08-01), Zavracky et al.
patent: 6621155 (2003-09-01), Perino et al.
patent: 6720643 (2004-04-01), Fox et al.
patent: 7037757 (2006-05-01), Fox et al.
patent: 2002/0040990 (2002-04-01), Tanaka et al.
patent: 6-291250 (1994-10-01), None
Harrington & Smith PC
Nokia Corporation
Tan Vibol
LandOfFree
Stacked IC device having functions for selecting and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked IC device having functions for selecting and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked IC device having functions for selecting and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3735054