Stacked fin heat sink and method of making

Details Stacked fin heat sink and method of making Stacked fin heat sink and method of making

2005-03-01

2005-03-01

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S123000

Reexamination Certificate

active

06861293

ABSTRACT:
A heat sink and method of making the same. The heat sink includes a plurality of substantially planar fins, each of substantially uniform thickness, which are stacked together in alternating relation to one another. Each fin includes a base portion, a top portion, a fin side and a base side, with the base side of each fin being joined to the base side of adjacent fins to form a substantially planar surface. The base side of each fin is dimensioned to form a space between the top portions of adjoining fins, the space being of a dimension that is substantially equal to the thickness of the fin. The method includes the steps of forming a plurality of substantially planar fins of a substantially uniform thickness, stacking the fins together in alternating relation to one another, and joining the stacked fins together to form the heat sink.

REFERENCES:
patent: 6050332 (2000-04-01), Smith et al.
Provisional U.S. Appl. No. 60/363,253, filed Mar. 11, 2002.

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