Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-05-08
2007-05-08
Yao, Sam Chuan (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S556000, C156S563000, C414S788900, C414S789900, C414S790200, C414S802000
Reexamination Certificate
active
10769310
ABSTRACT:
The subject invention relates to a precision injection molding of multi-piece parts and the subsequent handling and assembly of those parts produced from the mold. In an exemplary embodiment, a surgical suture package with a top part and a bottom part is molded and assembled. In such a method and system, the top parts and bottom parts are first molded utilizing a family mold and then are transferred to a stacker. The stacker is able to stack the top part and bottom part on top of one another on a pallet. The parts are then transported to a welder in order to weld the top part and bottom part together. The completed surgical suture packages are then transferred to a magazine for storage and shippage.
REFERENCES:
patent: 4120921 (1978-10-01), Webster
patent: 4915611 (1990-04-01), Brown
patent: 4976603 (1990-12-01), Disimone
patent: 5030406 (1991-07-01), Sorensen
patent: 5061169 (1991-10-01), Yamashiro et al.
patent: 5221538 (1993-06-01), Gasami et al.
patent: 5368466 (1994-11-01), Hehl
patent: 5773038 (1998-06-01), Hettinga
patent: 5840222 (1998-11-01), Herbst
patent: 5948341 (1999-09-01), Diamond et al.
patent: 6113828 (2000-09-01), Feick
patent: 6180032 (2001-01-01), Parnell, Sr. et al.
patent: 6245277 (2001-06-01), Diamond
patent: 6372170 (2002-04-01), Nishida et al.
patent: 6471505 (2002-10-01), Herbst
patent: 2002/0079619 (2002-06-01), Herbst
patent: 2002/0109263 (2002-08-01), Goldbach
patent: 2002/0121713 (2002-09-01), Moss et al.
patent: 0 765 726 (1997-04-01), None
patent: 0 813 946 (1997-12-01), None
patent: 3058816 (1991-03-01), None
patent: 3274129 (1991-12-01), None
patent: WO 00/61350 (2000-10-01), None
Clements Glynn
Howe Lynn
Torris William
Bose McKinney & Evans LLP
Jarden Corporation
Yao Sam Chuan
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